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TTM Technologies, Inc.

PCBs, RF components and radar mission systems for defense and space.

//Overview

TTM Technologies started in 1998 as a printed circuit board shop in Redmond, Washington and is now the largest PCB maker in North America and the largest supplier of circuit boards to the United States military. Getting there took acquisitions rather than organic growth. Honeywell Advanced Circuits in 2002, Tyco Printed Circuit Group in 2006, Viasystems in 2015, Anaren in 2018 for radio frequency components, and Telephonics in 2022 for $330 million, which pulled complete radar and surveillance systems into a company that had previously sold the boards inside them. Headquarters sit in Santa Ana, California. Around 15,000 people work across roughly thirty facilities in North America and Asia, with offices from Hong Kong and Bengaluru to Tokyo, St. Louis and Taipei. The stock trades on Nasdaq as TTMI and sits in the S&P 400.

The company reports in three segments. Aerospace and defense is the one that matters here and has been running close to 45 percent of revenue. Commercial is the larger unit by volume, covering automotive, medical, industrial and instrumentation, data center computing and networking. RF and specialty components sells TTM-designed parts and commercial off the shelf products. The interconnect catalogue runs from conventional rigid boards through high density interconnect, ultra-HDI, flex and rigid-flex, radio frequency and microwave laminates, substrate-like PCBs and thermal management constructions. On top of that sit Xinger branded RF components, circulators, resistive parts, transceivers and beamforming networks, then integrated assemblies, multi-chip modules, mixed-signal ASICs, ceramics, backplanes and MicroTCA products.

Mission systems is the Telephonics inheritance. TTM builds maritime surveillance and weather avoidance radars for fixed and rotary wing aircraft, uncrewed platforms and ships, along with communications and identification systems, and it is the sole supplier of the AN/APS-153 multi-mode radar carried by the Navy's MH-60R Seahawk, a line that has drawn orders past $330 million. Capacity is the current story. A $130 million facility in Syracuse, New York, including $30 million from the Department of War, opened for ultra-HDI production aimed squarely at domestic defense electronics supply, adding 400 jobs toward a Central New York workforce near 1,000 with volume production due in the second half of 2026. The company has also taken a 750,000 square foot plant in Eau Claire, Wisconsin and land rights in Penang, Malaysia, where the ramp has been the main margin story of the past year as yields on key programs climbed from roughly 40 percent to between 70 and 80 percent. Commercial space is now a named market of its own, which reflects how much launch and satellite demand has moved into the same high frequency, high layer count board technology that defense radar already required. The through line across all of it is that TTM sells the interconnect layer, and increasingly the box around it.

//Core Competencies
  • High reliability printed circuit board fabrication
  • Ultra-high density interconnect and HDI processing
  • Flexible and rigid-flex circuit manufacture
  • RF and microwave laminate and component design
  • Microelectronics and multi-chip module assembly
  • Backplane and system level electronics integration
  • Airborne and shipboard radar system design and production
  • Surveillance, communications and identification systems
  • Thermal management for dense electronics
  • Custom power supply design
  • Mixed-signal ASIC development
//Products & Services
productConventional PCBs

Rigid multilayer printed circuit boards across commercial and defense applications.

productHDI and ultra-HDI PCBs

High density interconnect boards, including domestic ultra-HDI production for national security programs.

productFlex and rigid-flex PCBs

Flexible and hybrid circuit constructions for constrained packaging.

productRF and microwave PCBs

Specialised laminate boards for radar, electronic warfare and communications payloads.

productSubstrate-like PCBs

Fine feature boards bridging conventional PCB and IC substrate technology.

productThermal management PCBs

Board constructions engineered to move heat out of dense assemblies.

productXinger RF components

Branded couplers, hybrids and related passive RF components.

productCirculators and isolators

Ferrite RF components for radar and communications front ends.

productBeamforming networks

Feed networks for phased array antennas.

productResistive components and transceivers

Terminations, attenuators and integrated transceiver products.

productRF and microwave assemblies

Integrated microelectronic and microwave assemblies built to customer specification.

productMulti-chip modules

Packaged multi-die microelectronic modules for dense defense electronics.

productMixed-signal ASICs

Custom application specific integrated circuits combining analogue and digital functions.

productCeramics

Ceramic substrates and packages for high reliability electronics.

productBackplane and system integration

Backplanes, chassis and integrated electronic systems.

productMicroTCA products

Open standard modular computing products for embedded applications.

productAN/APS-153 multi-mode radar

Maritime search radar for the US Navy MH-60R helicopter, supplied solely by TTM.

productMaritime surveillance radars

Lightweight search radars for fixed wing, rotary wing, uncrewed and shipboard platforms.

productWeather avoidance radars

Airborne weather radar systems for military and special mission aircraft.

productCommunications and identification systems

Intercommunication, identification and surveillance systems for ground, air and maritime platforms.

productCustom power supplies

Bespoke power conversion units for defense and industrial systems.

serviceEngineering and design for manufacture

Layout, materials and process engineering support for customer interconnect designs.

//Programs & Supply Chain

Programs & Platforms

MH-60R SeahawkSyracuse ultra-HDI facilityEau Claire expansionPenang expansion
//Contract Awards

$577,685 total contract value across 12 awards · $0 actually paid to date · Source: USASpending.gov

Contract value is total awarded ceiling, including option years that may never be exercised — not a single-year budget figure.

AgencyDescriptionContract ValuePaid to DateDate
Department of DefenseSPECIALIZED SEMICONDUCTOR, MICROCIRCUIT$231,2552025-10-15
Department of DefenseCIRCUIT CARD ASSEMBLIES - 1 LOT$103,6902022-09-26
Department of Defense8507335887!CIRCUIT CARD ASSEMB$0$02020-04-27
Department of DefensePRINTED CIRCUIT BOARDS.$98,0642019-10-28
Department of DefenseFABRICATION OF 20 EACH MODULAR MISSILE TECHNOLOGY (MMT) GENERATION3 (GEN3) MISSION COMPUTER(MC) PRINTED WIRING BOARDS (PWBS)SUPPORTING THE MMT CONTROLLED TEST VEHICLE (CTV) MISSILE EFFORT.$7,3352017-03-27
Department of DefenseALIC WIRING BOARDS$54,7362016-09-10
Department of DefenseLABORATORY EQUIPMENT AND SUPPLIES$19,7302016-06-01
Department of DefenseFIRM FIXED PRICE TO TTM TECHNOLOGIES FOR SOPM R2 TRACKER BOARDS FOR $6,121.80$6,1222015-03-02
Department of Defense8500756221!PRINTED WIRING BOAR$02014-03-20
Department of Defense4523223566!PRINTED WIRING BOAR$02012-12-17
Department of DefensePLANAR APERTURE$02012-09-26
Department of DefensePRINTED WIRING BOARDS$56,7532010-07-14
//Locations
HeadquartersHQ

USASanta Ana, California, USA

//Corporate & Financial

Ownership

Publicly traded · NASDAQ: TTMI